Telent designed and installed a new station data network (SDN) and Station Management System, MICA, at four international stations Warwick, U.K., 21 March 2023 – Essential work to upgrade communications systems across the HS1 rail network has been completed with minimal disruption at some of the UK’s busiest international rail stations. Telent was contracted by High Speed 1 (HS1) to upgrade all critical systems from legacy analogue to modern IP solutions at St Pancras, Stratford, Ebbsfleet and Ashford international stations. These improvements better protect the station and assets, grow the…
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Codasip adopts Siemens’ OneSpin tools for formal verification
Higher-quality verification to drive adoption and build momentum for RISC-V IP Munich, 3 May 2022 – Codasip, the leader in processor design automation, has expanded its adoption of formal verification solutions for comprehensive and thorough processor testing with the addition of OneSpin IC verification tools from Siemens EDA. Codasip has continually invested heavily in processor verification to underpin the company’s ability to deliver the industry’s highest quality RISC-V processor IP. Siemens EDA’s OneSpin tools provide an advanced and incredibly robust verification platform to tackle critical IC integrity issues. The highly…
Read MoreCodasip appoints Jamie Broome as its Automotive VP
Codasip presents car makers with a breakthrough in innovation and ownership of differentiation Munich, Germany – 21 April 2022 — Codasip, the leader in customizable RISC-V processor IP, today announced it has appointed Jamie Broome as its new VP Automotive. Broome brings over 20 years of experience in semiconductors and complex IP, SoCs and the automotive supply chain, having recently led Imagination Technologies’ Automotive Business unit dealing with the entire industry, from manufacturers to tier 1 suppliers and ecosystem partners. Broome brings significant experience of the ecosystem, industry contacts, as…
Read MoreAccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface
Product allows swift integration into any 5G Distributed Unit (DU) that supports the O-RAN AAL, enabling operators to select the most appropriate 5G physical layer accelerator cards to maximise flexibility and ease of deployment Southampton, UK – 26th October 2021 – AccelerComm, the company supercharging 5G with physical layer IP which increases spectral efficiency and reduces latency, today announced that it has successfully demonstrated a fully compliant O-RAN AAL (Acceleration Abstraction Layer) Forward Error Correction (FEC) product for the Xilinx Telco Accelerator cards. This carrier-grade product enables AccelerComm’s high performance…
Read MoreThalia-DA and Catena confirm successful tape-outs of first analog IP re-use projects
Sub-40nm process migration projects delivered with dramatically reduced project cycle time CWMBRAN, UK 31 July 2018 – Thalia Design Automation and Catena, a leader in radio frequency (RF) communication intellectual property (IP) for connectivity, today announced successful completion of their first jointly delivered analog IP reuse projects. The two companies have worked together to migrate Catena’s WiFi and variants of Bluetooth IP including a low-power version, between multiple sub-40nm process nodes and foundry providers. Analog IP providers increasingly need to respond to customer demands for absolute flexibility in their choice…
Read MoreCatena selects Thalia-DA to facilitate analog IP re-use
CWMBRAN, UK 13 December 2017 – Thalia Design Automation today announced that is has been selected by Catena, a leader in radio frequency (RF) communication intellectual property (IP) for connectivity, to support a range of projects that will enhance Catena’s analog IP reuse strategy, as the company seeks to diversify its portfolio of products to better serve system-on-chip (SoC) designers targeting mobile, Internet-of-things (IoT) and RF connectivity markets. Catena has a 30-year track record of partnering with global IC makers to design analog electronic systems, with particular strengths in RF…
Read MoreThalia DA attracts fresh investment as semiconductor industry recognizes the analog IP reuse challenge
Existing investors re-commit as customer traction grows CWMBRAN, WALES, UK, 16 October 2017 – Thalia Design Automation today announced the completion of a $865k (£640k) funding round that will allow it to drive market uptake of its innovative methodology solutions for analog IP (intellectual property) re-use, design migration and derivative creation. With renewed commitments from the company’s existing investors, Mercia Fund Managers and Finance Wales, this latest funding round is a recognition of significant customer traction achieved by Thalia within the last 18 months, and the strong future potential of…
Read MorePanasonic Signs First Pan-EMEA Distribution Agreement with Nuvias for IP Phone Handsets
Nuvias further expands portfolio for recently launched Unified Communications Practice London, England: 4/7/17: Panasonic Business has appointed Nuvias as its first pan-EMEA distributor for its range of business IP phone handsets. This marks a major vote of confidence in the recently-formed Nuvias Unified Communications Practice and is an important addition to Nuvias’ growing portfolio of leading products designed to deliver complete end-to-end unified communications (UC) solutions. The initial roll-out will focus on established markets for Nuvias, including the UK, Benelux, Germany and France, along with Southern Europe and the Nordics….
Read MoreGenesis Technical Systems joins the Broadband Forum
Genesis Technical Systems has become the newest member of the leading global organisation for broadband standards as it looks to shape the global telecom ecosystem Coventry, UK and Calgary, Canada – 26 June 2017 – Genesis Technical Systems is pleased to announce it is the newest member of the Broadband Forum, the leading industry body that is focused on engineering smarter and faster broadband networks. Joining the Forum will allow Genesis to leverage its shared goals with industry leaders from the membership as it works to provide innovative broadband technology…
Read MoreMoortec and UltraSoC collaborate to enable next-generation “smart” PVT sensors
CAMBRIDGE, United Kingdom, 12th April 2017: UltraSoC and Moortec Semiconductor today announced that they are cooperating on system-on-chip (SoC) monitoring and analytics intellectual property (IP) to enable a new generation of Process, Voltage and Temperature (PVT) sensor sub-systems. By integrating UltraSoC’s digital monitoring and optimization capabilities, with Moortec’s industry-leading PVT products this enables powerful, chip-wide infrastructure to improve SoC performance and reliability. Moortec’s PVT sensor sub-systems are widely used thoroughout the industy to allow intelligent control of system clock frequencies and voltage levels within supply domains, by sensing die temperature,…
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