THE SOI INDUSTRY CONSORTIUM PRESENTS ITS INAUGURAL AWARDS IN SHANGHAI, RECOGNIZING OUTSTANDING INDIVIDUALS FOR THEIR CONTRIBUTIONS TO SOI INDUSTRIAL DEVELOPMENT

Shanghai, China, Sept. 27, 2016 (GLOBE NEWSWIRE) — The SOI Industry Consortium, a non-profit organization representing the complete silicon-on-insulator (SOI)-based microelectronics value chain, has announced the recipients of its first SOI Industry Advancement awards, presented earlier this month in Shanghai during the consortium’s very successful and well-attended annual SOI forum, which demonstrated the strong and expanding interest in SOI technologies in China.  Two honorees were selected for their significant contributions to help grow global business opportunities for SOI technology including both fully depleted SOI (FD-SOI) and radio-frequency SOI (RF-SOI). The first recipient was recognized for his visionary and pioneering work in developing the SOI ecosystem in China and the second award winner for his contributions to RF-SOI industrialization worldwide.

“The SOI Industry Consortium wants to recognize the positive impacts made by these dedicated individuals toward the industrial advancement of SOI. We are very pleased to honor and celebrate some truly remarkable contributions with our inaugural industry awards,” said Carlos Mazuré, executive director of the SOI Industry Consortium. “This has been a pivotal year for SOI technologies with the introduction of the first FD-SOI-based consumer product and FD-SOI’s transition to a consolidated, globally accepted offering. In addition, the well-established RF-SOI ecosystem has made that technology predominant for antenna tuners, RF switches and applications in the developing IoT connectivity and 5G communication markets.”

The first award was given to Dr. Xi Wang, founder of National Silicon Industry Group (NSIG) and Chinese wafer suppliers Simgui and ZingSemi as well as director general of the Shanghai Institute of Microsystem and Information Technology (SIMIT), for his visionary and pioneering work in developing the SOI ecosystem in China. He has done substantial research in advanced microelectronic materials and novel IC processes, focusing on SOI materials. Dr. Wang also has been instrumental in promoting the advantages and applications of SOI in his roles as vice president of the China Association for Science and Technology (CAST) and deputy chief scientist of the China National Science and Technology Major Project of Semiconductor Equipment and Process for ULSI Manufacturing. He has worked as a visiting professor in both Australia and Germany and was elected as academician of the Chinese Academy of Sciences in 2009.

The second award was presented to Dr. Jean-Pierre Raskin, professor at Université catholique de Louvain (UCL) in Belgium, for his contributions to RF-SOI industrialization worldwide. Dr. Raskin has conducted groundbreaking research in modeling, wideband characterization and fabrication of advanced SOI MOSFETs. His pioneering work in the field of RF-SOI established the path for removing the major limiting factors affecting silicon-based technologies in microelectronics, which are substrate losses and non-linearities. Since earning his Ph.D. in applied sciences from UCL in 1997, Dr. Raskin has held academic positions there and at the University of Michigan, Ann Arbor, in the U.S. He is an IEEE Fellow and has written or co-authored more than 500 scientific articles.
The award ceremony was organized in conjunction with the annual SOI forum, held each year in Shanghai and co-organized by the SOI Industry Consortium, Verisilicon, the Shanghai Institute of Microsystem and Information Technology (SIMIT), Simgui and Shanghai Industrial µTechnology Research Institute (SITRI). This year’s event drew a record-high 335 participants. Of the attendees, 90 percent came from the semiconductor industry and 10 percent represented investment funds or government agencies. Industry decision makers accounted for 35 percent of all participants.

About the SOI Industry Consortium:
The SOI Industry Consortium is a non-profit organization representing the complete silicon-on-insulator (SOI)-based microelectronics value chain. The SOI Industry Consortium is chartered with promoting and supporting SOI-based technologies, a comprehensive approach to SOI ecosystems as well as innovation through application platforms. Among the activities of the SOI Industry Consortium, the association organizes industry-focused forums, workshops and training all over the world. Representing leaders from the entire electronics industry infrastructure, the SOI Industry Consortium’s current 28 members include Applied Materials, ARM, Cadence Design Systems, CEA-Leti, CWS, eVaderis, GLOBALFOUNDRIES, IBM, IMEC, Incize, Invecas, NXP, Samsung, Shin Etsu Handotai, Silvaco, Simgui, SIMIT, SITRI, Soitec, Stanford University, STMicroelectronics, Surecore, Synopsys, Verisilicon, University of California Berkeley, Université Catholique de Louvain, University of Tokyo and Xpeedic. Membership is open to all companies and institutions throughout the electronics industry. For more information, please visit www.soiconsortium.org.

Press Contact : Camille Dufour

Email : camille.darnaud-dufour@soiconsortium.org                                        

Mobile : +33 (0) 6 79 49 51 43                                                     

Legal Note

The views and opinions expressed by the SOI Industry Consortium through officers in the SOI Industry Consortium or in this presentation or other communication vehicles are not necessarily representative of the views and opinions of individual members. Officers of the SOI Industry Consortium speaking on behalf of the Consortium should not be considered to be speaking for the member company or companies they are associated with, but rather as representing the views of the SOI Industry Consortium. Views and opinions are also subject to change without notice, and the SOI Industry Consortium assumes no obligation to update the information in this communication or accompanying discussions.

SOI Industry Consortium Press release PDF http://hugin.info/173231/R/2045090/763817.pdf
 

Source: Globewire-Electronics

Related posts