UltraSoC launches “any processor” lockstep solution for safety-critical systems

CAMBRIDGE, UK – 29 November 2018 – UltraSoC, the leader in embedded analytics for the safety and security of automotive systems, today launched the UltraSoC Lockstep Monitor. A hardware-based, scalable solution, the new Lockstep Monitor significantly helps functional safety by checking that the cores at the heart of a critical system are operating reliably, safely and securely. UltraSoC’s flexible IP supports all common lockstep / redundancy architectures, including full dual-redundant lockstep, split/lock, master/checker, and voting with any number of cores or subsystems. The UltraSoC Lockstep Monitor can support any processor…

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MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC

Plymouth, UK, 29th November 2018 Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC. HPC is highly intensive in terms of CPU activity and requires ever increasing levels of computing power. This increased power consumption requires more electricity and this leads to much higher levels of heat generation. All this energy consumption equates to the costs of successfully implementing HPC easily becoming prohibitive. As the CPU temperatures…

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HUBER+SUHNER adds FullAXS Mini assemblies to its outdoor connectivity portfolio

Licensed from TE Connectivity, the connector sealing system offers small size, easy mating and extreme durability for fiber, signal and power connections Herisau, 30 October 2018. HUBER+SUHNER, a leading manufacturer of components and systems for optical and electrical connectivity, announced today that it has added FullAXS Mini assemblies under license from TE Connectivity to its outdoor connectivity offering for wireless communication and industrial applications. As electrical equipment for outdoor use continues to get smaller in size, the FullAXS Mini connector sealing system is 23 percent smaller than the well-known FullAXS…

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HZO Inc. Acquires Semblant Ltd. to Accelerate Expansion of Protective Coating and Waterproofing Solutions for Electronic Device Manufacturers

Acquisition Enables HZO to Expand its Portfolio of Technologies to More Quickly Deliver Additional Protection Solutions to Existing and New Customers That Need to Protect Products from Water and Other Harmful Substances SALT LAKE CITY, Oct. 23, 2018 (GLOBE NEWSWIRE) — HZO Inc., the world leader in advanced and scalable electronics waterproofing and protection solutions, announced today that it has acquired Semblant Ltd., a U.K.-based leader in protective nano coatings and waterproof technology. The acquisition enables HZO to more quickly introduce additional protection solutions to current and future customers of…

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Bel Will Report Third Quarter 2018 Results on November 1, 2018

Conference Call Scheduled for 11:00 AM ET JERSEY CITY, N.J., Oct. 18, 2018 (GLOBE NEWSWIRE) — Bel Fuse Inc. (“Bel,” or, “the Company”) (Nasdaq:BELFA and Nasdaq:BELFB), a leading supplier of products that power, protect and connect electronic circuits, today announced that the Company will release preliminary financial results for the third quarter of 2018 prior to the commencement of trading on Thursday, November 1, 2018. A conference call has been scheduled for 11:00 a.m. ET that morning to discuss the preliminary results. To participate in the conference call, investors should…

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UltraSoC extends tools offering with integrated multi-core debug, visualization and data science / analytics suite

UltraDevelop 2 IDE integrates partner technology from Imperas and Percepio CAMBRIDGE, UK, and Santa Clara, CA – 16 October 2018 UltraSoC today announced UltraDevelop 2, a complete integrated development environment (IDE) that combines comprehensive debug, run control, and performance tuning with advanced visualization and data science capabilities for system-on-chip (SoC) development teams. Incorporating technology from UltraSoC partners Imperas and Percepio, UltraDevelop 2 unleashes the potential of UltraSoC’s system-level on-chip monitoring and analytics infrastructure, providing actionable insights to dramatically cut development costs, shorten time-to-revenue and improve product quality. The new UltraDevelop…

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HUBER+SUHNER showcase e-mobility solutions for harsh environments at IZB 2018

The company will present its full automotive cable and system portfolio for electric vehicles including its state-of-the-art High Power Charging System Pfäffikon, 16 October. HUBER+SUHNER, leading manufacturer of components and systems for optical and electrical connectivity, will demonstrate its solutions which tackle electric vehicle requirements in the most harsh and demanding environments at IZB 2018, in Wolfsburg, October 16-18. With charging times for electric vehicles a major talking point for industries and governments alike, a key highlight at the booth will be the state-of-the-art RADOX® High Power Charging (HPC) system….

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Park Electrochemical Corp. Announces Introduction of RadarWave™ Prepreg Material for Advanced Radome Systems

MELVILLE, N.Y., Oct. 15, 2018 (GLOBE NEWSWIRE) — Park Electrochemical Corp. (NYSE-PKE) announces the introduction of RadarWave, an innovative new family of prepreg materials used to manufacture advanced radome systems principally for aerospace and defense applications.  RadarWave materials provide cost effective technical alternatives to the esoteric and higher cost materials traditionally used to manufacture advanced radome systems. Radomes are structural enclosures which protect RF/microwave and other antennas that transmit and receive electromagnetic signals from air, space, marine and ground based platforms.  Radomes are used for various aerospace and defense applications. …

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TTM Technologies, Inc. To Conduct Third Quarter 2018 Conference Call October 30, 2018

COSTA MESA, Calif., Oct. 10, 2018 (GLOBE NEWSWIRE) — TTM Technologies, Inc. (NASDAQ:TTMI) will host a conference call on Tuesday, October 30, at 4:30 p.m. Eastern Time/1:30 p.m. Pacific Time to discuss its third quarter 2018 performance. Telephone access is available by dialing 800-667-5617 or international 334-323-0509 (ID 9367022).  The conference call will also be simulcast on the company’s website, www.ttm.com, and will remain accessible for one week following the live event. TTM Technologies will release its third quarter 2018 financial results after the market closes on Tuesday, October 30,…

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‘Time to get ahead of the returns game’ says B-Stock

‘It’s time to start thinking seriously about the return value in consumer electronics’. That’s the message from returns and overstock specialists B-Stock as the annual flurry of video games released for Autumn and Christmas takes place. Ben Whitaker, Director EMEA at B-Stock, suggests that looking into the value of such products could well be a way to invigorate retailers, both those based in traditional brick and mortar stores and those using eCommerce platforms. Whitaker said: “A stark fact revealed recently by the Retail Gazette suggests returned goods are costing retailers…

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